Advanced Bonding Technologies
Different packaging structures require different bonding approaches. Sujatha Polymers supports multiple sophisticated lamination and adhesion technologies to accommodate diverse material combinations and application requirements.
Our Bonding Processes
Dry Bonding
Used for bonding compatible flexible packaging substrates through controlled adhesive application and curing.
Wet Bonding
Suitable for specific material combinations where adhesive bonding is performed before complete drying.
UV/EB Curing
Advanced curing technology for applications requiring controlled and efficient adhesive curing.
Hot-Melt Adhesion
Uses thermoplastic adhesives to create strong bonds across selected packaging materials.
Additional Technologies
Engineered Bonding. Optimized Packaging Performance.
Our range of bonding technologies allows material structures to be selected and engineered according to their required mechanical, barrier, sealing and printing characteristics.
